Thermally Conductive Adhesive Electrically Insulating Epoxy Fast Cure Heat Sink Staking
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Thermo-Bond 56 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. Thermo-Bond 56 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/23 |
| Working Life @ 25°C | 5 Minutes |
| Hardness, Shore D | 78 |
| Particle Size | 44 |
| Shelf Life | 1 year |
| Cure Type | Room Temp |
| Cure Schedule | 60 minutes @ Room Temp |
| Benefits | |
| Fast Cure, Strong Bond, durable High Impact Bonds at room temperature. | |
| Typical Applications | |
| Fibers optic, potting and connectors | |
Physical Properties |
|
| Appearance | Grey |
| Filler | Alumina |
| Viscosity | 12,000 |
| Substrates | metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials |
| Density @ 25°C | |
| Compressive Strength, PSI | 10000 |
| Specific Gravity @ 25°C | 2.25 |
| Hardness | 78 |
| Lap Shear Strength | 3400 |
| Reactive Solids Content, % | 100 |
| Tensile Strength, PSI | 3400 |
Electrical Properties |
|
| Volume Resistivity | 5.40 E+15 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +110°C |
| Glass Transition Temp (Tg) | 33 C |
| Thermal Expansion Coefficient, per °C | 14.4 |
| Heat Distortion, °C | 160 |
| Thermal Conductivity W/M-K | 0.84 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 5.83 |
