Graphite Filled Electrically Conductive Epoxy EMI RFI Shielding Adhesive Military Grade Heat Cure
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Electro-Bond 63 is one component graphite fille epoxy designed for Esd/Emi Shielding of semiconductor devices and electronics. Electro-Bond 63 can be used in many electronic application. Electro-Bond 63 is free of solvents, develops strong and durable, bonds to differents and dissimilar materilas such as metals, ceramics, glass .
Typical Properties |
|
| Components | 1 |
| Working Life @ 25°C | 6 months |
| Hardness, Shore D | 80 |
| Particle Size | 42 Micron |
| Shelf Life | 6 months |
| Cure Type | Heat Cure |
| Cure Schedule | 1 hour @ 120 C |
| Benefits | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
| Appearance | Grey |
| Filler | Graphite |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 11000 |
| Specific Gravity @ 25°C | 1.28 |
| Hardness | 80 |
| Lap Shear Strength | 2600 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.003 |
| Tensile Strength, PSI | 3600 |
Electrical Properties |
|
| Volume Resistivity | 43 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +170°C |
| Glass Transition Temp (Tg) | |
| Thermal Expansion Coefficient, per °C | |
| Heat Distortion, °C | 170 |
| Thermal Conductivity W/M-K | 0.25 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 1.7 |
