Carbon Filled Electrically Conductive High Strength Epoxy Coating Adhesive Dissipates Electrostatic
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Electro-Bond 61 is an epoxy adhesive and coating formulation based on conductive carbon . Electro-Bond 61 is recommended for electronic bonding and sealing applications that required both electrical and mechanical properties. Electro-Bond 61 cures at room temperature or can be accelerated with mild heat to form strong bond between similar and dissimilar substrates.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/10 |
| Working Life @ 25°C | 30 Minutes |
| Hardness, Shore D | 80 |
| Particle Size | 25 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 2 to4 hours @ 60°C |
| Benefits | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
| Appearance | Black |
| Filler | Carbon |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 12000 |
| Specific Gravity @ 25°C | 1.18 |
| Hardness | 80 |
| Lap Shear Strength | 1850 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.003 |
| Tensile Strength, PSI | 3500 |
Electrical Properties |
|
| Volume Resistivity | < 40 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +100°C |
| Glass Transition Temp (Tg) | 30°C |
| Thermal Expansion Coefficient, per °C | |
| Heat Distortion, °C | 100 |
| Thermal Conductivity W/M-K | 0.25 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 1.8 |
