Thermally Conductive Staking Epoxy Low NASA Outgassing Adhesive Electrically Insulating High-Impact
Thermo-Bond 51 is a thixotropic (smooth paste) heat conductive epoxy system that passes the NASA Outgassing Specification (TML :0.65 CVCM:0.02 WVR:0.12). It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 51 bonds readily to itself, and to metals, silica, satiate, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured Thermo-Bond 51 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/9 |
| Working Life @ 25°C | 40 Minutes |
| Hardness, Shore D | 89 |
| Particle Size | 44 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 3 hours @ 65°C |
| Benefits | |
| Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. | |
| Typical Applications | |
| Fibers optic, potting and connectors | |
Physical Properties |
|
| Appearance | Grey |
| Filler | Alumina |
| Viscosity | 40,000 |
| Substrates | Metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials |
| Density @ 25°C | |
| Compressive Strength, PSI | 10000 |
| Specific Gravity @ 25°C | 2.3 |
| Hardness | 89 |
| Lap Shear Strength | 7500 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.003 |
| Tensile Strength, PSI | 7500 |
Electrical Properties |
|
| Volume Resistivity | 2.10 E+15 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +125°C |
| Glass Transition Temp (Tg) | 60 |
| Thermal Expansion Coefficient, per °C | 14.4 |
| Heat Distortion, °C | 115 |
| Thermal Conductivity W/M-K | 0.92 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 6.52 |
