Flexible Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive 1 to 1 Mix Dispense
Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 cures at room temperature and can be used as a flexible ""cold-solder"" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/100 |
| Working Life @ 25°C | 60 Minutes |
| Hardness, Shore D | 63 |
| Particle Size | 44 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 2 to 4 hours @ 60°C |
| Benefits | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry. | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. | |
Physical Properties |
|
| Appearance | Silver |
| Filler | Silver |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 6500 |
| Specific Gravity @ 25°C | 2.46 |
| Hardness | 63 |
| Lap Shear Strength | 850 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.0016 |
| Tensile Strength, PSI | 1240 |
Electrical Properties |
|
| Volume Resistivity | 1.00 E-03 ohm. cm |
| Dielectric Constant | 4 |
| Dielectric Strength | 410 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +140°C |
| Glass Transition Temp (Tg) | 35 |
| Thermal Expansion Coefficient, per °C | 1.4 |
| Heat Distortion, °C | 170 |
| Thermal Conductivity W/M-K | 1.52 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 11 |
