Thermally Conductive FDA Food Grade Epoxy Medical Manufacturing Adhesive Staking Casting Bonding
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Thermo-Bond 26 is versatile food grade adhesive guaranteed a high strength bond. Thermo-Bond 26 is two parts adhesive used and cured at room temperature for bonding, repair applications by manufacturers of medical food preparation, processing and packaging equipment and devices.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/14 |
| Working Life @ 25°C | 50 Minutes |
| Hardness, Shore D | 82 |
| Particle Size | 45 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 25 hours @ Room Temp 2 to 4 hours @ 60°C |
| Benefits | |
| Designed for electronics applications, for the assembly line manufacturing, Heat Transfers components. | |
| Typical Applications | |
| Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards | |
Physical Properties |
|
| Appearance | Grey |
| Filler | Alumina |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 9,500 |
| Specific Gravity @ 25°C | 2.35 |
| Hardness | 82 |
| Lap Shear Strength | 1750 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.0012 |
| Tensile Strength, PSI | 1750 |
Electrical Properties |
|
| Volume Resistivity | 3.4 E+15 ohm. cm |
| Dielectric Strength | 410 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +135°C |
| Glass Transition Temp (Tg) | 113 |
| Thermal Expansion Coefficient, per °C | |
| Heat Distortion, °C | 170 |
| Thermal Conductivity W/M-K | 0.46 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 3.2 |
