Silver Filled Epoxy Adhesive, Electrically Conductive Adhesive, Circuit Repair, 1 Part Heat Cure
Electro-Bond 01 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. Electro-Bond 01 shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state. Electro-Bond 01 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others. Electro-Bond 01 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry."
Typical Properties |
|
| Components | 1 |
| Working Life @ 25°C | 6 months |
| Hardness, Shore D | 83 |
| Particle Size | 40 |
| Shelf Life | 6 months |
| Cure Type | Heat Cure |
| Cure Schedule | 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C |
| Benefits | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry, | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry | |
Physical Properties |
|
| Appearance | Silver |
| Filler | Silver |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 12000 |
| Specific Gravity @ 25°C | 2.79 |
| Hardness | 83 |
| Lap Shear Strength | 8700 |
| Tensile Strength, PSI | 8700 |
Electrical Properties |
|
| Volume Resistivity | 1.70 E-04 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +170°C |
| Glass Transition Temp (Tg) | |
| Thermal Expansion Coefficient, per °C | 0.49 |
| Heat Distortion, °C | 175 |
| Thermal Conductivity W/M-K | 2.65 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 18.37 |
