Copper & Silver Thermally Conductive Epoxy Electrically Conductive Adhesive EMI RFI Shielding
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Electro-Bond 13 is two parts epoxy high formulations for bonding and coating electronics parts . Electro-Bond 13 is special formulations for EMI & RFI shielding and in the assembly or repair of printed circuits boards, wave guides and electronics parts. Electro-Bond 13 is room temperature cure or can be accelerated by mild heat for faster cure.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/10 |
| Working Life @ 25°C | 30 Minutes |
| Hardness, Shore D | 80 |
| Particle Size | 45 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 2 to 4 hours @ 60°C |
| Benefits | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
| Appearance | Grey |
| Filler | Silver/Copper |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 3500 |
| Specific Gravity @ 25°C | 2.32 |
| Hardness | 80 |
| Lap Shear Strength | 940 PSI |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.003 |
| Tensile Strength, PSI | 1650 |
Electrical Properties |
|
| Volume Resistivity | 3.70 E-2 ohm. cm |
| Dielectric Constant | 4.2 |
| Dielectric Strength | 410 |
| Dissipation Factor KV/IN | 0.015 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +170°C |
| Glass Transition Temp (Tg) | 60°C |
| Thermal Expansion Coefficient, per °C | 30 |
| Heat Distortion, °C | 150 |
| Thermal Conductivity W/M-K | 1.15 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 8 |
