Electrically Conductive Silver Epoxy 1 Part Heat Cure Thermally Conductive Silver Loaded Adhesive
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Electro-Bond 79 is one-part epoxy adhesive with superior electrical conductivity and bonding capability. It has been shown to retain these properties through hundreds of hours of rapid temperature cycling (-40 to 150°C). It also has superior impact absorption and stress resistance. These qualities make it an excellent choice for a number of electronic applications in harsh operating environments. Electro-Bond 79 has a shelf life of at least 3 months when stored at 25°C. It contains no volatile, harmful solvents or lead, and conforms to all of the requirements of the solder replacement market.
Typical Properties |
|
| Components | 1 |
| Working Life @ 25°C | 3 months |
| Hardness, Shore D | 85 |
| Particle Size | 44 |
| Shelf Life | 3 months |
| Cure Type | Heat Cure Only |
| Cure Schedule | 2 hours @ 125°C | 1 hour @ 150°C | 1/2 hours @ 175°C |
| Benefits | |
| Designed for electronics applications, for the assembly line manufacturing, for high RF shieldings. | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
| Appearance | Silver |
| Filler | Silver |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 3600 |
| Specific Gravity @ 25°C | 2.62 |
| Hardness | 85 |
| Lap Shear Strength | 1720 |
| Reactive Solids Content, % | 100 |
| Tensile Strength, PSI | 1720 |
Electrical Properties |
|
| Volume Resistivity | 3.00 E -3 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +150°C |
| Glass Transition Temp (Tg) | 45°C |
| Thermal Expansion Coefficient, per °C | |
| Heat Distortion, °C | 150 |
| Thermal Conductivity W/M-K | 1.45 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 10.3 |
