Electrically Conductive Silver Filled Adhesive Thermally Conductive Silver Epoxy 1 Part Heat Cure
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Electro-Bond 20 is one part Electrically Conductive Adhesives, used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditional methods such as solder, are not practical. Electrically Conductive Adhesives are ideal for attaching temperature sensitive components, or providing electrical interconnections on non-solderable substrates, such as plastic and glass.
Typical Properties |
|
| Components | 1 |
| Working Life @ 25°C | 6 months |
| Hardness, Shore D | 80 |
| Particle Size | 44 |
| Shelf Life | 6 months |
| Cure Type | Heat Cure |
| Cure Schedule | 1 hour @ 120 °C 15 min @ 150 °C 4 min @ 175 °C |
| Benefits | |
| Intended for electronics applications, for the assembly line manufacturing, for high RF shieldings. | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
| Appearance | Silver |
| Filler | Silver |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 9,000 |
| Specific Gravity @ 25°C | 2.61 |
| Hardness | 80 |
| Lap Shear Strength | 900 |
| Reactive Solids Content, % | 100 |
| Tensile Strength, PSI | 3,500 |
Electrical Properties |
|
| Volume Resistivity | 3.00 E-4 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +170°C |
| Glass Transition Temp (Tg) | 42°C |
| Thermal Expansion Coefficient, per °C | |
| Heat Distortion, °C | 170 |
| Thermal Conductivity W/M-K | 1.43 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 10.2 |
